Axial vertical wafer electroplating cavity

The invention belongs to the technical field of wafer electroplating, and particularly relates to an axial vertical wafer electroplating cavity which comprises an electroplating cavity body, an anolyte pool and a catholyte pool located outside the anolyte pool are arranged in the electroplating cavi...

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Bibliographic Details
Main Authors LIU RUI, YANG SHIPIN
Format Patent
LanguageChinese
English
Published 10.05.2024
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The invention belongs to the technical field of wafer electroplating, and particularly relates to an axial vertical wafer electroplating cavity which comprises an electroplating cavity body, an anolyte pool and a catholyte pool located outside the anolyte pool are arranged in the electroplating cavity body, an anolyte inlet is formed in the inner bottom wall of the anolyte pool, and an anolyte outlet is formed in the inner bottom wall of the catholyte pool. An anolyte outlet extending to the bottom of the electroplating cavity is further formed in the inner top wall of the anolyte pool, a catholyte inlet is formed in the inner bottom wall of the catholyte pool, and a cathode overflow outlet is formed in the inner side bottom wall of the electroplating cavity. According to the axial vertical wafer electroplating cavity, by arranging the electroplating liquid concentration balancing mechanism, electroplating liquid can be fully balanced, on one hand, the whole electroplating face is balanced, the problem that t
Bibliography:Application Number: CN202410428713