Alkynyl-crosslinked low-dielectric-constant heat-resistant polyimide film and preparation method thereof

• Main Authors: REN FENGMEI, XIA YUJIE, CAI ZHIHUAN, ZHANG HUI, ZHANG JIA, HE JIAJIA, LIU TANA, HUANG FAN
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The invention relates to an alkynyl-crosslinked low-dielectric-constant heat-resistant polyimide film, which is prepared by the following steps: (1) reacting aromatic dianhydride, aromatic diamine and a monomer of which the main chain contains an alkynyl structure in a solvent to prepare polyamide acid of which the main chain contains alkynyl; (2) preparing a polyimide film through film coating and thermal imidization; and (3) heating the polyimide film at a high temperature to open alkynyl so as to prepare the thermally-crosslinked low-dielectric-constant polyimide film. According to the invention, alkynyl is introduced into a molecular chain, and then the low-dielectric heat-resistant polyimide film is prepared through thermal crosslinking. 本发明涉及一种炔基交联的低介电常数、耐热的聚酰亚胺薄膜，制备步骤包括:(1)芳香族二酐、芳香族二胺和主链含炔基结构的单体在溶剂中进行反应，制备主链含炔基的聚酰胺酸；(2)再经涂膜，热亚胺化制备聚酰亚胺薄膜；(3)将聚酰亚胺薄膜在高温下加热使炔基打开制备热交联的低介电常数聚酰亚胺薄膜。本发明通过在分子链中引入炔基，再通过热交联制备了低介电、耐热聚酰亚胺薄膜。