Semiconductor photoresist compositions and methods of forming patterns using same
Disclosed are a semiconductor photoresist composition including an organometallic compound, an additive represented by Chemical Formula 1, and a solvent, and a method of forming a pattern using the semiconductor photoresist composition. Details of the chemical formula 1 are defined in the specificat...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
07.05.2024
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed are a semiconductor photoresist composition including an organometallic compound, an additive represented by Chemical Formula 1, and a solvent, and a method of forming a pattern using the semiconductor photoresist composition. Details of the chemical formula 1 are defined in the specification.
公开一种半导体光刻胶组合物,包含有机金属化合物、由化学式1表示的添加剂以及溶剂,以及一种使用所述半导体光刻胶组合物形成图案的方法。化学式1的细节如说明书中所定义。 |
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Bibliography: | Application Number: CN202311349030 |