Ceramic structure for edge emission chip and preparation process of ceramic structure

• Main Authors: GAO LEI, DANG JUNJIE, WANG LYUHUA, XIA MINGKUANG, ZHANG HAO, LI BIN, QI YUNJIE
• Format: Patent
• Language: Chinese; English
• Published: 03.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRICITY

The invention belongs to the technical field of ceramic packaging, and particularly relates to a ceramic structure for an edge emission chip and a preparation process of the ceramic structure. The ceramic structure comprises a ceramic bottom plate and a ceramic boss arranged on the ceramic bottom plate. The ceramic boss is provided with a first bonding pad used for assembling a chip or a device and a second bonding pad used for signal leading-out bonding. The ceramic bottom plate is provided with a sixth bonding pad, a fourth bonding pad used for welding a ring frame with an optical window, a fifth bonding pad used for being welded with a PCB, and a seventh bonding pad used for back welding alignment. According to the invention, the function of directly emitting light from the side surface after packaging the edge-emitting chip can be realized, the design that light path reflection needs to be carried out in conventional packaging to realize light emitting is abandoned, the structure of the edge-emitting chip