Wafer clamping mechanism and wafer transmission device

• Main Authors: YANG SHUWEN, LI ZHENG, YU PENGYANG, LI LIN
• Format: Patent
• Language: Chinese; English
• Published: 03.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to the technical field of semiconductor production equipment, in particular to a wafer clamping mechanism and a wafer transmission device. The wafer clamping mechanism comprises a bracket, a first clamping component, a second clamping component and a linear driving component, wherein the linear driving component, the first clamping component and the second clamping component are arranged on the bracket; the first clamping component comprises a first clamping part, the second clamping component comprises a second clamping part, and the first clamping part and the second clamping part are oppositely arranged in a spaced mode in the preset direction; and the linear driving component drives the first clamping part and the second clamping part to be close to or far away from each other along a preset direction, so that the first clamping part and the second clamping part clamp or release two preset edges of the special-shaped wafer. The wafer transmission device comprises the wafer clamping m