Process for removing low molecules in heat conduction material

• Main Authors: ZHANG TIANGUANG, ZENG SIRUI, LUO GAOMING, PAN MINZHENG, LI JIEGAN
• Format: Patent
• Language: Chinese; English
• Published: 03.05.2024
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; MAKING GRANULES OR PREFORMS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention relates to the technical field of heat conduction material treatment processes, and particularly discloses a process for removing low molecules in a heat conduction material. According to the process disclosed by the invention, heat-conducting material products with ultralow volatile matter content, such as heat-conducting gel with ultralow volatile matter content, heat-conducting pouring sealant with ultralow volatile matter content, heat-conducting silicone grease with ultralow volatile matter content, heat-conducting gaskets and the like, can be prepared through the steps of feeding, stirring, discharging, post-processing and the like. Therefore, the process technology is wide in application range. The heat-conducting gel, the heat-conducting pouring sealant, the heat-conducting silicone grease and the heat-conducting gasket prepared by the process have the characteristic of ultralow volatile matters, and the effect of no volatile condensate is achieved. The stirring equipment comprises the w