BRUSH AND SUBSTRATE PROCESSING APPARATUS PROVIDED WITH SAME

The purpose of the present invention is to enable cleaning without damaging the cleaning surface of a substrate by instantaneously following the inclination of the substrate by causing a brush to act on the surface of the substrate. The invention relates to a brush and a substrate processing apparat...

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Bibliographic Details
Main Authors YASUTAKE YOSUKE, ONO TAKUYA, ISHIKAWA MICHIAKI
Format Patent
LanguageChinese
English
Published 03.05.2024
Subjects
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Summary:The purpose of the present invention is to enable cleaning without damaging the cleaning surface of a substrate by instantaneously following the inclination of the substrate by causing a brush to act on the surface of the substrate. The invention relates to a brush and a substrate processing apparatus including the same. When the cleaning unit (77) is located at the peripheral edge of the substrate, the outer peripheral brush (515) moves in the vertical direction with respect to the central brush (513) in accordance with the inclination of the peripheral edge. The outer peripheral brush (515) instantaneously moves upward by a reaction force from the substrate (W) in accordance with a target load, the reaction force being stronger than the biasing force of the compression coil spring (517). Therefore, the acting surface of the brush (99) has an inclined shape following the substrate. As a result, since the outer peripheral brush (515) does not generate skew deformation and almost only the central brush (513) a
Bibliography:Application Number: CN202311384994