PCB production method for preventing hole wall separation

The invention relates to the technical field of PCB production, in particular to a PCB production method for preventing hole wall separation. According to the method, drilling and plating tank milling are carried out on the laminated multilayer circuit board, and the roughness of the hole wall and t...

Full description

Saved in:
Bibliographic Details
Main Authors ZHONG GENDAI, LI SHIWU, LAN FUMIN
Format Patent
LanguageChinese
English
Published 30.04.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The invention relates to the technical field of PCB production, in particular to a PCB production method for preventing hole wall separation. According to the method, drilling and plating tank milling are carried out on the laminated multilayer circuit board, and the roughness of the hole wall and the roughness of the tank wall of the plating tank are controlled respectively; the multi-layer circuit board after deburring is sequentially subjected to first-time board drying and plasma degumming, and the temperature of the first-time board drying is increased by 1-15 DEG C on the basis of the temperature of a TG point of a prepreg; the PCB production method comprises the following steps of: performing copper deposition, electroplating, pattern processing and resistance welding on a multi-layer circuit board, performing secondary board drying before the resistance welding process, and controlling the temperature of the secondary board drying to be 120-160 DEG C. The PCB production method capable of preventing ho
Bibliography:Application Number: CN202311856354