SOLDER ALLOY, BONDED POWER, BONDED MATERIAL, SOLDER PASTE, BONDED STRUCTURE, AND

A solder alloy capable of forming a joint portion having heat cycle resistance and drop impact resistance, the solder alloy containing 45 mass% to 63 mass% (inclusive) of Bi, 0.1 mass% to less than 0.7 mass% of Sb, and 0.05 mass% to 1 mass% (inclusive) of In, the remainder being Sn and unavoidable i...

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Bibliographic Details
Main Authors SHIMAZAKI TAKANORI, ARAI MASAYA, OCHI GENKI, MARUYAMA DAISUKE
Format Patent
LanguageChinese
English
Published 26.04.2024
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:A solder alloy capable of forming a joint portion having heat cycle resistance and drop impact resistance, the solder alloy containing 45 mass% to 63 mass% (inclusive) of Bi, 0.1 mass% to less than 0.7 mass% of Sb, and 0.05 mass% to 1 mass% (inclusive) of In, the remainder being Sn and unavoidable impurities, the liquidus temperature of the solder alloy is 170 DEG C or less. 一种软钎料合金，其为能形成具有热循环耐性和耐落下冲击性的接合部的软钎料合金，且所述软钎料合金包含：45质量％以上且63质量％以下的Bi、0.1质量％以上且低于0.7质量％的Sb和0.05质量％以上且1质量％以下的In，余量为Sn和不可避免的杂质，所述软钎料合金的液相线温度为170℃以下。
Bibliography:Application Number: CN202280008100