High-strength fixing sucker for transferring semiconductor wafer

• Main Authors: LUO ZHONGPING, ZHANG KAI, ZHAO PENGZHI
• Format: Patent
• Language: Chinese; English
• Published: 19.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a high-strength fixing suction cup for transferring a semiconductor wafer, and relates to the field of semiconductor processing equipment. According to the invention, the plurality of suction nozzles distributed in an array manner are used for adsorbing and transferring the wafer, so that the middle part and the outer ring of the surface of the wafer can be adsorbed by the suction nozzles at different positions when the wafer is adsorbed and transferred, thereby preventing the outer ring of the wafer from bending downwards and deforming under the action of gravity of the wafer to cause damage to the wafer; meanwhile, the size and the adsorption force of a single suction nozzle can be correspondingly reduced, so that the wafer is prevented from being deformed and broken under the action of the adsorption force; even if part of the suction nozzles in the suction nozzle array fail to complete wafer adsorption due to faults or other external force factors, the adsorption transfer process o