POWER ROUTING FOR 2.5 D OR 3D INTEGRATED CIRCUIT

• Main Authors: LIN XIWEI, MOROZ VICTOR
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments relate to an electronic circuit implemented using a first integrated circuit die, a second integrated circuit die, and an interposer connecting the first integrated circuit die to the second integrated circuit die. The first integrated circuit die implements a first electronic circuit. The first integrated circuit die includes a first set of contacts on a bottom surface, a buried power rail (BPR), and a plurality of through-silicon vias (TSVs) for connecting the BPR to the first set of contacts. The interposer includes a second set of contacts and a power delivery network (PDN). Each contact in the second set of contacts corresponds to a contact in the first set of contacts of the first integrated circuit die. The PDN is configured to route a power supply voltage to the second set of contacts. 实施例涉及一种电子电路，该电子电路使用第一集成电路管芯、第二集成电路管芯和中介层被实现，该中介层将第一集成电路管芯连接到第二集成电路管芯。第一集成电路管芯实现第一电子电路。第一集成电路管芯包括在底表面上的第一组接触部、埋入式电源轨(BPR)和用于将BPR连接到第一组接触部的多个硅通孔(TSV)。中介层包括第二组接触部和电源输送网络(PDN)。第二组接触部中的每个接触部对应于第一集成电路管芯的第一组接触部中的接触