Method for manufacturing semiconductor element package and semiconductor element package

• Main Authors: TANAKA EISAKU, ISHII KYOKO, INOUE TAKEO, SUGAYA YOSUKE, KONTANI TOMOHIRO
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a method for manufacturing a plurality of semiconductor element packages using a substrate sheet on which a plurality of semiconductor elements are disposed, the method being suitable for suppressing damage to the semiconductor element packages due to an increase in internal pressure. Provided is a method for producing a double-sided pressure-sensitive adhesive sheet having a plurality of through-holes, a porous sheet, and pressure-sensitive adhesive layers formed in advance on both surfaces of the porous sheet, a step for obtaining a laminated body by joining a cover sheet and a substrate sheet on which a plurality of semiconductor elements are arranged so that the semiconductor elements are positioned in the through-holes and covered by the cover sheet; and dividing the laminate to obtain a plurality of covers, a plurality of substrates, and a plurality of porous bodies from the cover sheet, the substrate sheet, and the porous body sheet, respectively. 本发明提供一种制造方法，该制造方法是使用配置有多个半导体元件的基板片而制造多个半导体元