Electrostatic chuck device

An electrostatic chuck device is provided with: an electrostatic chuck plate having a dielectric substrate provided with a mounting surface on which a sample is mounted, and an adsorption electrode positioned inside the dielectric substrate; and a base which supports the electrostatic chuck plate fr...

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Main Authors MORISHITA NORITO, YOSHIOKA YOSHIKI, MAEDA KEISUKE, ITAGAKI TETSURO
Format Patent
LanguageChinese
English
Published 16.04.2024
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Abstract An electrostatic chuck device is provided with: an electrostatic chuck plate having a dielectric substrate provided with a mounting surface on which a sample is mounted, and an adsorption electrode positioned inside the dielectric substrate; and a base which supports the electrostatic chuck plate from the opposite side of the mounting surface, in which a first through hole for supplying gas to the mounting surface is provided in the electrostatic chuck plate, a porous body through which the gas passes is inserted in the first through hole, and a second through hole through which the gas passes is inserted between the inner peripheral surface of the first through hole and the outer peripheral surface of the porous body. A first adhesive layer that adheres the inner peripheral surface and the outer peripheral surface to each other is provided, and the thickness dimension of the first adhesive layer is 0 mm or more and 0.15 mm or less at least in a region up to 0.1 mm from the placement surface. 一种静电卡盘装置,其具备:静电卡
AbstractList An electrostatic chuck device is provided with: an electrostatic chuck plate having a dielectric substrate provided with a mounting surface on which a sample is mounted, and an adsorption electrode positioned inside the dielectric substrate; and a base which supports the electrostatic chuck plate from the opposite side of the mounting surface, in which a first through hole for supplying gas to the mounting surface is provided in the electrostatic chuck plate, a porous body through which the gas passes is inserted in the first through hole, and a second through hole through which the gas passes is inserted between the inner peripheral surface of the first through hole and the outer peripheral surface of the porous body. A first adhesive layer that adheres the inner peripheral surface and the outer peripheral surface to each other is provided, and the thickness dimension of the first adhesive layer is 0 mm or more and 0.15 mm or less at least in a region up to 0.1 mm from the placement surface. 一种静电卡盘装置,其具备:静电卡
Author ITAGAKI TETSURO
MORISHITA NORITO
YOSHIOKA YOSHIKI
MAEDA KEISUKE
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Snippet An electrostatic chuck device is provided with: an electrostatic chuck plate having a dielectric substrate provided with a mounting surface on which a sample...
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SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
Title Electrostatic chuck device
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