Dynamic electrostatic chuck and preparation method thereof

The invention provides a dynamic electrostatic chuck and a preparation method thereof, and the dynamic electrostatic chuck sequentially comprises an electrostatic adsorption module (1) which comprises a dielectric layer (12), an electrode layer (13) and a substrate (14) from top to bottom, the diele...

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Bibliographic Details
Main Authors WANG CHANGTAO, LUO XIANGANG, ZHAO BO, LI JIAN, FAN KAILI, WANG QIANG, WANG YANQIN
Format Patent
LanguageChinese
English
Published 16.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a dynamic electrostatic chuck and a preparation method thereof, and the dynamic electrostatic chuck sequentially comprises an electrostatic adsorption module (1) which comprises a dielectric layer (12), an electrode layer (13) and a substrate (14) from top to bottom, the dielectric layer (12) is provided with a bump array (11), and the bump array (11) is used for adsorbing a wafer (4) through electrostatic force; the surface type adjusting module (2) comprises a piezoelectric ceramic driver array (21) and is used for dynamically adjusting and controlling the surface type of the wafer (4) by applying voltage; and the base (3) is used for bearing the electrostatic adsorption module (1) and the surface type adjusting module (2) and leading out an electrode lead of the piezoelectric ceramic driver array (21). According to the dynamic electrostatic chuck disclosed by the invention, the wafer surface type can be precisely controlled while the wafer is stably adsorbed. 本公开提供一种动态静电吸盘及其制备方法，该动态静
Bibliography:Application Number: CN202311713566