Polymer micro-fluidic chip bonding electrode design and optimization method

The invention provides a method for designing and optimizing a bonded electrode of a polymer micro-fluidic chip. The method comprises the following steps: initializing a micro-electrode structure according to the structure distribution of the micro-fluidic chip; designing a microelectrode preparatio...

Full description

Saved in:
Bibliographic Details
Main Authors ZHANG LU, JIANG BINGYAN, WU WANGQING, ZHAO BAISHUN
Format Patent
LanguageChinese
English
Published 16.04.2024
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:The invention provides a method for designing and optimizing a bonded electrode of a polymer micro-fluidic chip. The method comprises the following steps: initializing a micro-electrode structure according to the structure distribution of the micro-fluidic chip; designing a microelectrode preparation process; a microelectrode heating bonding simulation model is constructed, and electricity-heat-stress simulation analysis is carried out; analyzing simulation results including electrode temperature distribution, potential loss density, micro-fluidic chip heat distribution and micro-channel deformation quantity; electrode materials, bonding parameters and electrode layout are optimized; repeating until the design requirement is met; a microelectrode with an optimized structure is prepared through a microelectrode preparation process; assembling a micro-fluidic chip and a microelectrode; and loading a bonding pressure and a bonding power supply to complete bonding of the polymer micro-fluidic chip based on microe
Bibliography:Application Number: CN202410061906