Three-phase wiring board, forming method and application thereof, and injection mold

• Main Authors: XU PENGFEI, YING YUKUN, XU KANGNING
• Format: Patent
• Language: Chinese; English
• Published: 12.04.2024
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DYNAMO-ELECTRIC MACHINES; ELECTRICITY; GENERATION; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention discloses a three-phase wiring board and a forming method and application thereof, and an injection mold, the three-phase wiring board comprises an injection molding plate and three power connection sheets, the injection molding plate is annular, the three power connection sheets are respectively connected on the injection molding plate in an integrated injection molding manner, the injection molding plate comprises an inner end face facing one side of a stator and an outer end face facing the outer side, and the inner end face and the outer end face are connected with the injection molding plate in an integrated injection molding manner. Wherein main bodies of the three power connection sheets are arc-shaped and arranged around the center of the injection molding plate, and each power connection sheet is located between an inner ring and an outer ring of the injection molding plate; and first connecting structures are arranged on the outer side edges of the first part and the second part of eac