Power module and manufacturing method thereof

The invention relates to a power module and a manufacturing method thereof. The power module includes a semiconductor chip, an insulating circuit board including an insulating layer and a first metal layer disposed on a first surface of the insulating layer, and a lead frame disposed between the sem...

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Bibliographic Details
Main Authors KANG, SU BIN, HONG KYOUNG-KOOK, KIM YOUNG-SEOK
Format Patent
LanguageChinese
English
Published 12.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a power module and a manufacturing method thereof. The power module includes a semiconductor chip, an insulating circuit board including an insulating layer and a first metal layer disposed on a first surface of the insulating layer, and a lead frame disposed between the semiconductor chip and the insulating circuit board. 本发明涉及功率模块及其制造方法。功率模块包括半导体芯片、绝缘电路板和引线框架，所述绝缘电路板包括绝缘层和布置在绝缘层的第一表面上的第一金属层，所述引线框架布置在半导体芯片和绝缘电路板之间。
Bibliography:Application Number: CN202310647020