Positioning dispensing device for electronic component processing

• Main Authors: HUANG WENJIE, HONG JIABIN
• Format: Patent
• Language: Chinese; English
• Published: 12.04.2024
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CLEANING; CLEANING IN GENERAL; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The invention relates to the technical field of electronic component dispensing and positioning, in particular to a positioning and dispensing device for electronic component processing, which comprises a platform, a positioning mechanism is mounted at the top of the platform, the positioning mechanism comprises two side plates, the side plates are fixedly mounted at the top of the platform, and the two side plates are fixedly mounted at the top of the platform. First sliding grooves are formed in the side portions of the two side plates correspondingly, the positioning plates are slidably installed in the first sliding grooves, a positioning frame is fixedly installed at the top of each positioning plate, the first toothed plates are fixedly installed at the tops of the side plates, gears are rotationally installed on the two sides of each positioning frame correspondingly, and the gears are engaged with the first toothed plates. The second sliding groove is formed in the top of the positioning frame. Accord