Light emitting diode and light emitting device

The invention relates to the technical field of semiconductor manufacturing, in particular to a light-emitting diode and a light-emitting device. The light-emitting diode comprises an epitaxial structure, a second bonding pad electrode and a first bonding pad electrode, wherein the epitaxial structu...

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Main Authors HU PENGJIE, ZHOU LIPING, KE WEIFAN, LIU JIAYU, PENG YUREN, XU CHANGJIANG, LIU SHENGNAN, GUO HUANSHAO, HOU WENYING
Format Patent
LanguageChinese
English
Published 09.04.2024
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Summary:The invention relates to the technical field of semiconductor manufacturing, in particular to a light-emitting diode and a light-emitting device. The light-emitting diode comprises an epitaxial structure, a second bonding pad electrode and a first bonding pad electrode, wherein the epitaxial structure comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are stacked in sequence; wherein the surface of the second bonding pad electrode is provided with a wire bonding area, and the surface, located in the wire bonding area, of at least part of the second bonding pad electrode is of a concave-convex structure; and/or, the surface of the first bonding pad electrode is provided with a routing area, and the surface of at least part of the first bonding pad electrode located in the routing area is of a concave-convex structure; and the concave-convex structure comprises one or more convex parts and concave parts relative to the convex parts. Through the above design, the
Bibliography:Application Number: CN202311797094