High-thermal-conductivity adhesive composition and application thereof

• Main Authors: LIU JUNQING, DUAN CHUNTING, WEI JIANMING, RUAN RUYU, LIANG WENBIN, ZHENG DONGFANG, GAO GUANGHUI
• Format: Patent
• Language: Chinese; English
• Published: 09.04.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention relates to a heat-conducting adhesive composition, a method for using the composition and a masonry heat storage material layer obtained by using the heat-conducting adhesive for bonding. The heat-conducting binder composition comprises a heat-conducting material, a high-temperature binder and a solvent, and the weight ratio of the heat-conducting material to the high-temperature binder is 90: 10 to 60: 40. A masonry heat storage material layer obtained by bonding with the heat-conducting adhesive disclosed by the invention has high and remarkably improved heat conductivity. 本发明涉及一种导热粘结剂组合物、使用该组合物的方法，以及使用根据本发明所述的导热粘结剂粘接得到的砌筑储热材料层。所述导热粘结剂组合物包含导热材料，高温粘结剂和溶剂，其中，所述导热材料与高温粘结剂的重量比为90∶10至60∶40。使用根据本发明所述的导热粘结剂粘接得到的砌筑储热材料层具有高的显著改善的热导率。