Substrate processing method and substrate processing apparatus

• Main Authors: MITSUKI YUTA, NAKANISHI MASAYUKI, SATAKE MASAYUKI
• Format: Patent
• Language: Chinese; English
• Published: 05.04.2024
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The present invention relates to a substrate processing method and a substrate processing apparatus for suppressing cracks and defects in a laminated substrate formed by bonding a plurality of substrates, and in particular, to a technology for applying a filler to gaps formed between edge portions o...