Substrate processing method and substrate processing apparatus

• Main Authors: MITSUKI YUTA, NAKANISHI MASAYUKI, SATAKE MASAYUKI
• Format: Patent
• Language: Chinese; English
• Published: 05.04.2024
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The present invention relates to a substrate processing method and a substrate processing apparatus for suppressing cracks and defects in a laminated substrate formed by bonding a plurality of substrates, and in particular, to a technology for applying a filler to gaps formed between edge portions of a plurality of substrates constituting the laminated substrate. In this method, the surface shapes of the edge (E1) of the first substrate (W1) and the edge (E2) of the second substrate (W2) are measured, the application conditions of the filler (F) applied to the laminated substrate (Ws) are determined on the basis of the measurement results, and the filler (F) is applied to the gap (G) between the edge (E1) of the first substrate (W1) and the edge (E2) of the second substrate (W2) of the laminated substrate (Ws) under the determined application conditions. 本发明关于抑制将多片基板接合而制成的层叠基板的破裂和缺损的基板处理方法和基板处理装置，特别关于将填充剂涂布于构成层叠基板的多片基板的边缘部之间形成的间隙的技术。在本方法中，测定第一基板(W1)的边缘部(E1)和第二基板(W2)的边缘部(E2)的表面形状，并根据测定结果来决定涂布于层叠基板(Ws)的填充剂(F)的涂