EMI shielding adhesive compositions and uses thereof

• Main Author: KIKUCHI YUKARI
• Format: Patent
• Language: Chinese; English
• Published: 05.04.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; WORKING-UP

The purpose of the present invention is to provide an acrylic resin-containing adhesive composition having high EMI shielding performance, in which the composition provides an EMI shielding cured product having high impact resistance and sufficiently cured at low temperatures, and the adhesive surface has high tear strength when the composition is applied to a metal surface. The present invention relates to an EMI shielding adhesive composition comprising (a) a conductive filler, (b) a (meth) acrylic resin, (c) a tackifier, (d) bismaleimide, and (e) a radical initiator. 本发明的目的是提供具有高EMI屏蔽性能的含丙烯酸类树脂的粘合剂组合物，其中该组合物提供具有高抗冲击性且在低温下充分固化的EMI屏蔽固化产物，并且当将该组合物施加至金属表面时，粘合表面具有高扯离强度。本发明涉及EMI屏蔽粘合剂组合物，所述EMI屏蔽粘合剂组合物包含(a)传导性填料、(b)(甲基)丙烯酸类树脂、(c)增粘剂、(d)双马来酰亚胺和(e)自由基引发剂。