Flexible metal-clad plate, preparation method thereof and flexible circuit board

• Main Authors: HUANG LIMING, LI YING, CHEN ZHUYU
• Format: Patent
• Language: Chinese; English
• Published: 02.04.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention belongs to the technical field of circuit board printing. The invention discloses a flexible metal-clad plate. The flexible metal-clad plate comprises a metal layer and a polyimide layer, the polyimide layer is arranged on one side of the metal layer, the polyimide layer comprises poly...