Flexible metal-clad plate, preparation method thereof and flexible circuit board

• Main Authors: HUANG LIMING, LI YING, CHEN ZHUYU
• Format: Patent
• Language: Chinese; English
• Published: 02.04.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention belongs to the technical field of circuit board printing. The invention discloses a flexible metal-clad plate. The flexible metal-clad plate comprises a metal layer and a polyimide layer, the polyimide layer is arranged on one side of the metal layer, the polyimide layer comprises polyimide resin, and the polyimide resin comprises three structural units with different structural formulas; and the fluorine content in the polyimide layer is greater than or equal to 20wt%. The invention discloses a preparation method of a flexible metal-clad plate. The invention also discloses a flexible circuit board. The fluorine content of the polyimide molecular chain is improved by introducing the atomic group C-F with low polarizability, so that the molar polarizability of the polyimide molecular chain is reduced, the free volume is increased, and the dielectric constant of the flexible metal-clad plate is reduced. 本申请属于电路板印刷技术领域。本申请公开了一种挠性覆金属板，该挠性覆金属板包括金属层和聚酰亚胺层；聚酰亚胺层设于金属层的一侧，聚酰亚胺层包括聚酰亚胺树脂，聚酰亚胺树脂包括三种不同结构式的结构