CUTTING DEVICE AND METHOD FOR MANUFACTURING CUTTED ARTICLE

• Main Authors: ONISHI SHOMA, HORI SATOKO, YOSHIOKA SHO, HORIMOTO, KYOTARO
• Format: Patent
• Language: Chinese; English
• Published: 29.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention provides a cutting device capable of cleaning a flange and a method for manufacturing a cut product. The cutting device comprises a blade replacing mechanism for replacing a blade arranged on a main shaft part; and a cleaning mechanism for cleaning a pair of flanges for fixing the blade to the main shaft part. 本发明提供一种可进行凸缘的清洗的切断装置以及切断品的制造方法。切断装置包括：刀片更换机构，对设于主轴部的刀片进行更换；以及清洗机构，对用于将所述刀片固定于所述主轴部的一对凸缘进行清洗。