Binder composition for molding mold

This binder composition for molding a mold contains an alkaline phenolic resin, an imidazole compound represented by formula (1), and water. According to the present invention, it is possible to provide a binder composition for molding a mold and a composition for molding a mold, which have excellen...

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Bibliographic Details
Main Authors KANZAWA SATOSHI, NAKAHATA YU, YAMAYA MITSUHITO
Format Patent
LanguageChinese
English
Published 29.03.2024
Subjects
CASTING
FOUNDRY MOULDING
PERFORMING OPERATIONS
POWDER METALLURGY
TRANSPORTING
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Summary:This binder composition for molding a mold contains an alkaline phenolic resin, an imidazole compound represented by formula (1), and water. According to the present invention, it is possible to provide a binder composition for molding a mold and a composition for molding a mold, which have excellent storage stability and are capable of suppressing thickening during storage and suppressing deterioration of fluidity and filling properties of the composition for molding a mold. (In general formula (1), R1, R2, R3, and R4 each independently represent a hydrogen atom or a hydrocarbon group having 1-4 carbon atoms. > # imgabs0 # 本发明的铸模造型用粘结剂组合物含有碱性酚醛树脂、下述式(1)所示的咪唑化合物以及水。根据本发明，能够提供抑制保存时的增稠、抑制铸模造型用组合物的流动性和填充性的恶化的、保存稳定性优异的铸模造型用粘结剂组合物及铸模造型用组合物。(所述通式(1)中，R1、R2、R3及R4各自独立地表示氢、或碳数1以上且4以下的烃基。)#imgabs0#
Bibliography:Application Number: CN202280055226