Flexible low-cost piezoelectric composite material with high d33 value

The present disclosure relates to filling a polymer composite comprising a piezoelectric filler and a polymer resin. The composite material can exhibit a piezoelectric coefficient d33 of greater than 30 pC/N when measured according to the Balan ancient method using a d33 piezometer, and the composit...

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Bibliographic Details
Main Authors GROEN, WILLEM, A, KALAFUSKAS, JAMES, A, HARICH, JOHN, VAN DER ZWAAG, SJOERD
Format Patent
LanguageChinese
English
Published 26.03.2024
Subjects
ELECTRICITY
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Summary:The present disclosure relates to filling a polymer composite comprising a piezoelectric filler and a polymer resin. The composite material can exhibit a piezoelectric coefficient d33 of greater than 30 pC/N when measured according to the Balan ancient method using a d33 piezometer, and the composite material exhibits a density of less than 5 g/cc according to the Archimedes method. 本公开涉及填充包含压电填料和聚合物树脂的聚合物复合材料。当根据贝兰古方法使用d33压电计来测量时，所述复合材料可呈现大于30pC/N的压电系数d33，并且根据阿基米德方法，所述复合材料呈现小于5g/cc的密度。
Bibliography:Application Number: CN202311767150