Package substrate and manufacturing method thereof

The invention provides a package substrate and a manufacturing method thereof. According to the packaging substrate, a circuit block body is arranged on a substrate body through a bonding layer, the circuit block body is wrapped by a wrapping layer, a circuit part is formed on the wrapping layer, an...

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Bibliographic Details
Main Authors LIN SONGKUN, ZHANG CHUIHONG, CHEN MINYAO
Format Patent
LanguageChinese
English
Published 26.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a package substrate and a manufacturing method thereof. According to the packaging substrate, a circuit block body is arranged on a substrate body through a bonding layer, the circuit block body is wrapped by a wrapping layer, a circuit part is formed on the wrapping layer, and a conductive column body is formed in the wrapping layer, so that the circuit block body can be embedded in the wrapping layer without making a groove. Therefore, the packaging substrate provided by the invention can shorten the process time. 本发明提出一种封装基板及其制法。封装基板包括于一基板本体上通过结合层设置一线路块体，再以包覆层包覆该线路块体，之后于该包覆层上形成线路部，且于该包覆层中形成导电柱体，因而无需制作凹槽，即可将该线路块体埋设于该包覆层中，故本发明的封装基板能缩减工艺时间。
Bibliography:Application Number: CN202211203514