High frequency and high power thin film assembly

A surface mount assembly is disclosed that includes a thermally conductive, electrically insulating beam. The electrically insulating beam has a first end and a second end opposite the first end. The surface mount assembly includes a membrane assembly formed on the electrically insulating beam adjac...

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Bibliographic Details
Main Authors KORONY GHEORGHE, NELSON CHRISTOPHER
Format Patent
LanguageChinese
English
Published 26.03.2024
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Summary:A surface mount assembly is disclosed that includes a thermally conductive, electrically insulating beam. The electrically insulating beam has a first end and a second end opposite the first end. The surface mount assembly includes a membrane assembly formed on the electrically insulating beam adjacent a first end of the electrically insulating beam. A heat sink terminal is formed on the electrically insulating beam adjacent the second end of the electrically insulating beam. In some embodiments, the thin film assembly has an area power capacity greater than about 0.17 W/mm2 at about 28 GHz. 公开了一种表面安装组件,包括导热的电绝缘梁。电绝缘梁具有第一端和与第一端相对的第二端。表面安装组件包括在电绝缘梁上与电绝缘梁的第一端相邻地形成的薄膜组件。在电绝缘梁上与电绝缘梁的第二端相邻地形成散热器端子。在一些实施例中,在约28GHz处,薄膜组件的面积功率容量大于约0.17W/mm2。
Bibliography:Application Number: CN202311519759