Microelectronic structure including bridge

Microelectronic structures including bridges and related components and methods are disclosed herein. In some embodiments, a microelectronic structure may include a substrate and a bridge. 本文公开了包括桥接器的微电子结构以及相关组件和方法。在一些实施例中，微电子结构可以包括衬底和桥接器。...

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Bibliographic Details
Main Authors TRIPATHI, ANSHUMAN, CETEGEN, EUGEN, KARHADE OMKAR G, DESHPANDE NITIN A
Format Patent
LanguageChinese
English
Published 22.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Microelectronic structures including bridges and related components and methods are disclosed herein. In some embodiments, a microelectronic structure may include a substrate and a bridge. 本文公开了包括桥接器的微电子结构以及相关组件和方法。在一些实施例中，微电子结构可以包括衬底和桥接器。
Bibliography:Application Number: CN202311687248