Resin composition and application thereof

• Main Authors: JIN SONG, ZENG ZHIXIONG, LIU CHENGJIE, ZHOU HUIHUI, YUAN CAN, BAO XUSHENG
• Format: Patent
• Language: Chinese; English
• Published: 22.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES; WIRELESS COMMUNICATIONS NETWORKS

The embodiment of the invention provides a resin composition, the resin composition comprises an epoxy resin, a curing agent and an inorganic filler, the cut-off particle size of the inorganic filler is 3 [mu] m, the D10 of the inorganic filler is 0.1 [mu] m-0. 4 [mu] m, the D50 of the inorganic filler is 0.5 [mu] m-1. 1 [mu] m, and the D90 of the inorganic filler is 1.3 [mu] m-2. 9 [mu] m. The resin composition has low viscosity and high fluidity, and has good narrow gap filling capability. The embodiment of the invention also provides application of the resin composition. 本申请实施例提供一种树脂组合物，所述树脂组合物包括环氧树脂、固化剂和无机填料，所述无机填料的截止粒径为3μm，所述无机填料的D10为0.1μm-0.4μm，D50为0.5μm-1.1μm，D90为1.3μm-2.9μm。该树脂组合物具有低粘度和高流动性，具备良好的窄间隙填充能力。本申请实施例还提供了该树脂组合物的应用。