Composite resin composition and application thereof

• Main Authors: SHEN YONGXIAN, WEN WENYAN, GUO YONGJUN
• Format: Patent
• Language: Chinese; English
• Published: 22.03.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention provides a composite resin composition and application thereof.The composite resin composition is prepared from, by mass, 10-50 parts of epoxy resin, 10-30 parts of benzoxazine resin, 10-50 parts of a curing agent, 5-30 parts of a flame retardant and 10-60 parts of inorganic filler; wherein the curing agent contains a compound as shown in a formula (1). The composite resin has the advantages of high heat resistance, favorable cohesiveness, low water absorption, lower dielectric constant and lower dielectric loss value. 本申请提供一种复合树脂组合物及其应用，按照质量份数计，所述复合树脂组合物包括：环氧树脂10份~50份，苯并噁嗪树脂10份~30份，固化剂10份~50份，阻燃剂5份~30份，无机填料10份~60份；其中，所述固化剂含有式(1)所示化合物。该复合树脂兼具高耐热性、良好的粘结性、低吸水率、较低的介电常数和介质损耗值。