SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS USING THE SAME

• Main Authors: YUN KANG-SEOP, SONG XIUHAN, KANG MIN OK, LEE YOUNG-IL, CHOI JUNG-BONG
• Format: Patent
• Language: Chinese; English
• Published: 19.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a substrate heating apparatus and a substrate processing apparatus using the same, and more particularly, to a substrate heating apparatus and a substrate processing apparatus using the same, the structure of which is improved so as to be able to effectively cool a terminal strip. The present invention provides a substrate heating device for heating a substrate, the substrate heating device comprising: a heating unit which is a heat source disposed below the substrate; a cooling plate which is disposed below the heating unit and supplies cold air; and a terminal strip that supplies power to the heating unit and has a lower end portion in contact with the cooling plate. 本发明涉及基板加热装置和利用其的基板处理装置，更详细地涉及构造改善成能够有效地冷却端子条的基板加热装置和利用其的基板处理装置。本发明提供一种基板加热装置，用于加热基板，其特征在于，所述基板加热装置包括：加热部，是配置于所述基板的下方的热源；冷却板，配置于所述加热部的下侧而提供冷气；以及端子条，向所述加热部供应电力，且下端部与所述冷却板接触。