Image enhancement for defect inspection based on machine learning
A system and method for defect inspection of a semiconductor sample is provided. The method includes: obtaining an original image of a semiconductor sample, the original image having a first region annotated as surrounding a defect feature; specifying a second region in an original image including a...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
19.03.2024
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A system and method for defect inspection of a semiconductor sample is provided. The method includes: obtaining an original image of a semiconductor sample, the original image having a first region annotated as surrounding a defect feature; specifying a second region in an original image including a first region, thereby generating a background region between the first region and the second region; in the target image of the semiconductor sample, identifying a candidate region set matched with the background region according to the matching measurement; selecting one or more candidate regions from the candidate region set; and pasting the first region or a portion of the first region with respect to the one or more candidate regions, thereby producing an enhanced target image usable for defect inspection on the semiconductor sample.
提供了一种用于对半导体样品进行缺陷检查的系统和方法。该方法包括:获得半导体样品的原始图像,该原始图像具有被注释为包围缺陷特征的第一区域;在包含第一区域的原始图像中指定第二区域,从而在所述第一区域与所述第二区域之间产生背景区域;在半导体样品的目标图像中,根据匹配测量来识别与背景区域匹配的候选区域集合;从该候选区域集合中选择一个或多个候选区域;以及相对于一个或 |
---|---|
Bibliography: | Application Number: CN202311206999 |