Wafer pre-alignment method and wafer thickness measurement method and device

• Main Authors: CHEN GANG, ZHANG YUNBO, PENG BOFANG
• Format: Patent
• Language: Chinese; English
• Published: 15.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a wafer pre-alignment method and a wafer thickness measuring method and device, and the device comprises an objective table which can rotate and move back and forth, a bottom plate is connected with a vacuum air groove used for vacuum adsorption of a wafer, and the left side and the right side of the bottom plate are connected with a left supporting column and a right supporting column respectively. The left supporting column and the right supporting column are connected with a CCD camera and a linear laser respectively, the included angle between the laser incident direction of the laser and the normal direction of the device is 60 degrees, and the included angle between the laser received and reflected by the CCD and the normal direction of the device is also 60 degrees, so that a set of incident and reflected light path is formed. And the ejector pin is connected with a cylinder below the bottom plate. The invention also provides a method for performing thickness and pre-alignment