Data center cabinet-level composite cooling system based on micro-channel loop heat pipe

• Main Authors: WU JINXIA, CAO JIAMING, CHENG HUI, PENG TENGFEI, WANG ZHANGYUAN, CHEN JING
• Format: Patent
• Language: Chinese; English
• Published: 12.03.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a data center cabinet-level composite cooling system based on a micro-channel loop heat pipe, and relates to the technical field of data center efficient heat dissipation, the data center cabinet-level composite cooling system comprises an evaporation assembly, a condensation assembly, a cooling assembly and an automatic control assembly, and the outlet end of the condensation assembly is communicated with the inlet end of the evaporation assembly through a condensation loop; the outlet end of the evaporation assembly communicates with the inlet end of the condensation assembly through an evaporation loop, the cooling assembly circularly communicates with the condensation assembly through a cooling loop, a temperature sensor is arranged on the evaporation assembly, and the automatic control assembly is electrically connected with the temperature sensor and the cooling assembly. The evaporation assembly comprises a plurality of heat pipe partition plates, and the heat pipe partition pla