Diffusion bonding forming method

• Main Authors: SU SHENGWEI, LIU JICHEN, QIN ZHONGHUAN, LIU WEI, LI XIN, LI BAOYONG, LI YANHUA, DING KEDI, HAN BING
• Format: Patent
• Language: Chinese; English
• Published: 12.03.2024
• Subjects: COMBINED OPERATIONS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; TRANSPORTING; UNIVERSAL MACHINE TOOLS

The invention relates to a diffusion bonding forming method, belongs to the technical field of material forming, and solves the problems of long period, low precision and the like of a plate body mixed structure forming method in the prior art. The invention provides a diffusion bonding forming method which comprises the following steps: S1, disassembling a plate body mixed structure of a formed part to obtain a semicircular cylinder section and a peripheral boss; s2, the semi-cylindrical section is blanked, and a rectangular steel plate is obtained; blanking a peripheral boss to obtain a block blanking piece; s3, the rectangular steel plate is subjected to hot-pressing preforming, and a semicircular cylinder section is obtained; s4, the semi-cylindrical section and the boss are integrally subjected to diffusion connection, and a diffusion connection piece of the mixed structure is obtained; and S5, the two semicircular cylinder sections are welded into a whole, and final forming is completed. According to th