Wafer morphology measurement method and device, readable storage medium and electronic equipment

The invention discloses a wafer morphology measurement method and device, a readable storage medium and electronic equipment, and is applied to a wafer morphology measurement system which comprises a measurement motion platform for placing a wafer, and an edge finder, a morphology measurement probe...

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Bibliographic Details
Main Authors MA TIEZHONG, XIANG XIAOSHAN, GAO WEIZE
Format Patent
LanguageChinese
English
Published 08.03.2024
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:The invention discloses a wafer morphology measurement method and device, a readable storage medium and electronic equipment, and is applied to a wafer morphology measurement system which comprises a measurement motion platform for placing a wafer, and an edge finder, a morphology measurement probe and a positioning camera which are erected near the measurement motion platform, the method comprises the following steps: carrying out coarse positioning search on a wafer by utilizing an edge finder so as to place the wafer on a measurement motion platform; controlling the measurement motion platform to move the wafer so as to enable the circle center of the wafer to move to the center of the positioning camera, and collecting a template image for positioning; and calculating the coordinates of the moving points and the sampling points of each scanning line in the coordinate system of the measurement motion platform, controlling the measurement motion platform to sample the wafer according to the scanning track a
Bibliography:Application Number: CN202311484870