IC wafer sand blasting method

• Main Authors: ZHOU HUIXIA, BAI PINGPING
• Format: Patent
• Language: Chinese; English
• Published: 08.03.2024
• Subjects: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL; GRINDING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention belongs to the technical field of IC (integrated circuit) chip processing, and discloses an IC chip sand blasting method which specifically comprises the following steps: (1) placing an IC chip on a conveying belt, and conveying the IC chip to a sand blasting gun by the conveying belt at a speed of 4-5mm/s; (2) carrying out sand blasting on the IC chip by a sand blasting gun under the pressure of 0.25-0.30 MPa and by adopting a sand material with the particle size of 60-70 meshes; (3) turning over the IC chip, and performing the step (1) and the step (2) again; and (4) cleaning the residual sand on the surface of the IC chip, and taking out the IC chip. By controlling the speed of the conveying belt, the pressure of the sand blasting gun and the particle size of the sand, the cleaning effect of a coating on the surface of the IC chip can be guaranteed, and the surface and the structure of the IC chip can be guaranteed not to be damaged. 本发明属于IC片加工技术领域，公开了一种IC片喷砂方法，所述方法具体为：步骤(1)：将IC片放置在输送带上，输送带以4