Automatic redistribution layer via generation

A system and method for automatically generating an arrangement of vias within a redistribution layer of a semiconductor package is described. A user defines attributes to be used for automatic via generation in a redistribution layer of a semiconductor package (702). Circuitry of a processor of a c...

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Bibliographic Details
Main Authors GARDI RENATOMATULLA, VENKATARAMANI, RAJAGOPALAN, SANTOS WARREN ALEXANDER, MARTINEZ RYAN, SURIEL, DENNIS, GLENN, LOCHANTA
Format Patent
LanguageChinese
English
Published 01.03.2024
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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