Composite stripping layer for carrier ultrathin copper foil and application of composite stripping layer

• Main Authors: CHEN WEIYU, ZHONG WEIBIN, YE DAIXUAN, LI JIANJUN, XIE XIANCHAO, LEE WON-TAE, PAN GUANGHUA
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2024
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention belongs to the technical field of ultrathin copper foil preparation, and relates to a composite stripping layer for a carrier ultrathin copper foil and application of the composite stripping layer. The composite stripping layer comprises an organic coating and a metal coating; the organic coating is prepared from chitosan and polyaniline; and the metal coating is a metal chromium coating. After chitosan is grafted with polyaniline, the adsorption performance on metal ions is greatly improved, and meanwhile, the conductivity of the organic coating is improved by means of the conductivity of polyaniline. Chitosan and aniline are loaded on a carrier copper foil through an electrochemical method, then a chromium metal layer is deposited to obtain a composite stripping layer, and the composite stripping layer is high in chromium adsorption capacity, excellent in conductivity, uniform in thickness and easy to strip and has wide application in ultrathin copper foil preparation. 本发明属于超薄铜箔制备技术领域，涉及一种用于载体