Optical packages integrated using in-mold embedded (EIM) optical modules

• Main Authors: GANESAN SANKA, TADAYON PAMELA, GAMBA JAMES M, MEI SONG, KIM DUKHWAN
• Format: Patent
• Language: Chinese; English
• Published: 27.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

In one embodiment, an optical module includes an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector. The photonic integrated circuit transmits or receives an optical signal. The pluggable optical coupling connector is adjacent to the photonic integrated circuit and includes a pluggable interface for optically coupling an optical fiber array to the photonic integrated circuit. Further, the electronic integrated circuit, the photonic integrated circuit, and the pluggable optical coupling connector are all embedded in a molding. 在一个实施例中，一种光学模块包括电子集成电路、光子集成电路和可插拔光学耦合连接器。所述光子集成电路发送或接收光信号。所述可插拔光学耦合连接器与所述光子集成电路相邻并且包括用于将光纤阵列光学耦合到所述光子集成电路的可插拔接口。此外，所述电子集成电路、所述光子集成电路和所述可插拔光学耦合连接器全部嵌入模制物中。