Packaging device with protective layer and manufacturing method thereof

• Main Authors: ZHONG MEIYUN, YU QIANQIAN, CHEN KAI, XU LIANG, GUO JIAQI, FAN KAIPING
• Format: Patent
• Language: Chinese; English
• Published: 27.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a packaging device with a protective layer and a manufacturing method thereof, and relates to the technical field of semiconductor devices.The manufacturing method comprises the following steps that S1, the packaging device is provided, and the packaging device comprises a substrate, a semiconductor element fixed to the substrate and a packaging adhesive layer covering the semiconductor element; s2, depositing along the side surface and the upper surface of the packaging device to form a SiO2 protection layer; s3, depositing along the surface of the SiO2 protective layer to form an Al2O3 protective layer; and S4, depositing along the surface of the Al2O3 protective layer to form a Si3N4 protective layer. The SiO2 protective layer, the Al2O3 protective layer and the Si3N4 protective layer are sequentially deposited on the surface of the packaging device, so that the waterproof capability of the packaging device can be effectively improved, and water vapor is prevented from invading the