Test fixture for crimping type packaging device

The invention relates to a test fixture for a crimping type packaging device. Comprising a first electrode assembly, a second electrode assembly and a clamping assembly, the first electrode assembly comprises a first heat dissipation base, a first extraction electrode used for being attached to a fi...

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Bibliographic Details
Main Authors SHI PEIFENG, CHENG JI
Format Patent
LanguageChinese
English
Published 27.02.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
TESTING
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Summary:The invention relates to a test fixture for a crimping type packaging device. Comprising a first electrode assembly, a second electrode assembly and a clamping assembly, the first electrode assembly comprises a first heat dissipation base, a first extraction electrode used for being attached to a first electrode of the semiconductor device, and a first insulating part arranged between the first extraction electrode and the first heat dissipation base; the second electrode assembly comprises a second heat dissipation base, a second extraction electrode used for being attached to a second electrode of the semiconductor device, and a second insulating part arranged between the second extraction electrode and the second heat dissipation base. The clamping assembly is connected with the first electrode assembly and the second electrode assembly and used for adjusting the distance between the first electrode assembly and the second electrode assembly so as to clamp the semiconductor device. The problem that an exis
Bibliography:Application Number: CN202311341258