Bonding process of silicon carbide seed crystals

The invention discloses a bonding process of silicon carbide seed crystals. The bonding process comprises the following steps that S1, graphite powder, a sodium silicate solution and polyvinyl alcohol are evenly mixed in proportion to form a flowing filling bonding prefabricated object; s2, one of t...

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Bibliographic Details
Main Authors QIAO SHUAISHUAI, LI YUANTIAN
Format Patent
LanguageChinese
English
Published 27.02.2024
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Summary:The invention discloses a bonding process of silicon carbide seed crystals. The bonding process comprises the following steps that S1, graphite powder, a sodium silicate solution and polyvinyl alcohol are evenly mixed in proportion to form a flowing filling bonding prefabricated object; s2, one of the seed crystal and the crucible cover is coated with high-temperature glue, and then the seed crystal or the crucible cover coated with the high-temperature glue is evenly coated with the filling bonding prefabricated object to form a filling prefabricated layer; s3, putting the seed crystal or the crucible cover coated with the filling prefabricated layer into a high-purity carbon dioxide atmosphere to realize room-temperature curing; s4, adhering the other one of the seed crystal and the crucible cover to the filling prefabricated layer cured at the room temperature through high-temperature glue; and S5, sintering the adhered seed crystal and crucible cover in a hot-pressing sintering furnace. According to the b
Bibliography:Application Number: CN202311509147