Airflow impact type liquid homogenizing mechanism for electroplating bath

• Main Authors: PENG HONGJUN, ZHOU FENG, YANG XIYUN, YUAN XIAOJU, HE AIZHI, DING RONGJUN
• Format: Patent
• Language: Chinese; English
• Published: 27.02.2024
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention discloses an airflow impact type liquid homogenizing mechanism for an electroplating bath. The airflow impact type liquid homogenizing mechanism comprises an outer box body, an isolation plate, an airflow impact mechanism and a transmission mechanism, external air flow is sucked in through the air inlet pipe, the air flow enters the positioning pipe head through the telescopic pipe, the positioning pipe head conveys air through the splitter plate, the air flow enters the air guide ring cover through the splitter plate and is exhausted from the multiple exhaust heads, and then the air guide ring cover is driven by the transmission mechanism to do lifting motion and rotating motion. Therefore, electroplating liquid in the electroplating bath is greatly impacted by airflow, electroplating substances of the electroplating liquid are uniformly distributed, the operation is convenient, and the liquid homogenizing effect is good. 本发明公开了一种电镀槽用气流冲击式匀液机构，包括外部箱体、隔离板、气流冲击机构、传动机构；本发明通过入气管将外部气流吸入，气流通过伸缩管进入定位管