Gas spraying assembly of semiconductor equipment

• Main Authors: YE LEIJIANG, LI BINPENG, KONG DEJUN, ZHANG SUMEI
• Format: Patent
• Language: Chinese; English
• Published: 27.02.2024
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A semiconductor device gas spraying assembly disclosed by the present invention comprises a main shell, the main shell is a cylindrical sleeve body piece, an inner cavity extending upwards is formed in the middle of the bottom surface of the main shell, a gas inlet through hole is formed in the middle of a top plate of the main shell, and a gas distribution plate is arranged in the middle of the inner cavity; a plurality of air outlet cylinders extending downwards are formed in the middle of the bottom face of the air distribution plate, the air outlet cylinders are vertically aligned and communicated with corresponding through holes formed in the air distribution plate, and a plurality of side air injection through holes are formed in the side walls of the air outlet cylinders. An air injection plate is fixed to the bottom of the main shell and covers the bottom of the inner cavity, a plurality of air injection through holes are formed in the air injection plate, and all the air injection through holes are e