Low-stress packaging pressure sensitive element and method

• Main Authors: CAI YAPING, DUAN JIUXUN, CHANG YUNWEI
• Format: Patent
• Language: Chinese; English
• Published: 23.02.2024
• Subjects: MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; PHYSICS; TESTING

The invention provides a low-stress packaging pressure sensitive element and method, and relates to the field of chip packaging, and the low-stress packaging pressure sensitive element comprises an integrated pedestal sintered part, a ceramic insulating cover, a pin, a corrugated diaphragm, a pressing ring, a chip, a ceramic substrate and high borosilicate glass. The ceramic substrate and the high borosilicate glass are installed in the integrated base sintering part, the ceramic substrate is connected with the integrated base sintering part through the high borosilicate glass, the chip is installed on the bonding face of the ceramic substrate, the pin is installed at the position, close to the chip, in the integrated base sintering part, and the corrugated diaphragm and the pressing ring are welded to the chip and the ceramic substrate. The ceramic insulating cover surrounds the chip, the ceramic substrate is arranged at a preset height position higher than the bottom surface of the integrated base sintered