Semiconductor packaging piece burr removing device and method

• Main Authors: KIM BYOUNG-GEUN, KANG, HONG GOO
• Format: Patent
• Language: Chinese; English
• Published: 23.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention provides a burr removing device and method for a semiconductor package. The burr removing device and method can remove burrs remaining on the semiconductor package after a sputtering process for electromagnetic wave shielding is carried out. The purpose of the present invention is to s...